Reduce 3D IC Design Complexity with Early Package Assembly Verification

Moore’s Law may be slowing, but chip innovation isn’t. 2.5D and 3D ICs are pushing boundaries, offering unmatched performance. However, managing the design complexity can be daunting.

Disaggregation, foundry selection, and optimal placement are only a few hurdles to overcome.

Learn how Calibre Shift Left solutions can empower your team to conquer these challenges head-on and accelerate your 3D IC design process.

Download this white paper and gain in-depth insights into:

• Mastering multi-dimensional IC design complexities
• Optimizing the 3D IC design workflow
• Achieving superior design efficiency with Calibre Shift Left

Push the boundaries of chip technology with this paper.